High-Temperature Shape Memory Alloys via PBF-LB/M

Copper-based shape memory alloys such as Cu-11.85Al-3.2Ni-3Mn, with a density of 7.27 g/cm³ (99.86%) and adjustable activation temperatures between 100 and 300 °C, open up new opportunities for high-temperature applications. While titanium-based alloys like Nitinol are primarily used at lower activation temperatures, copper-based systems enable significantly higher transformation temperatures and robust processing via PBF-LB/M. The alloy exhibits stable recovery rates under cyclic loading, making it ideal for demanding applications in aerospace or energy technology where higher activation temperatures are required.

 

Contact: 

Dr. Aron Pfaff, aron.pfaff@emi.fraunhofer.de

Image 1: The alloy is well-suited for processing via PBF-LB/M, even for complex lattice structures. Image 2: Stable activation temperatures for filigree structures.
© Fraunhofer EMI