Fraunhofer-Gesellschaft

Research Topics of the Fraunhofer Competence Field Additive Manufacturing

Materials

Materials research provides answers to current issues in the fields of energy, health, mobility, information and communication technologies as well as in construction and housing.

Technology

In product development companies are confronted with constantly changing markets. To achieve integrated production processes, it is important to accurately analyze all the processes and technologies involved in the product life cycle and to optimally synchronize the production processes.

Engineering

By taking nature as a role model, scientists develop ideas and products that can be specifically adapted to environmental conditions.

Quality

In order to improve the reliability and shape accuracy of all products generated by addititve manufacturing, we develop individual security systems for your entire product development process.

Software und simulation

Additive manufacturing is closely linked to the digital control of the manufacturing process: components are manufactured directly on the basis of a digital representation.

News

 

rapid.tech 3D eXzellenzpreis

On May 6, 2026, the Excellence Award will be presented for the first time at rapid.tech 3D.

 

News 1.25

You can find the latest newsletter at the link below.

Retrospective

 

formnext

The formnext will take place in Frankfurt am Main from November 18 to 21, 2025. The Fraunhofer Competence Center for Additive Manufacturing will be located in Hall 11 at Booth D31.              

press material

 

Rapid.Tech 3D

The rapid.tech 3D trade fair took place in Erfurt from May 13 to 15, 2025. The Fraunhofer Competence Center for Additive Manufacturing was located at booth 2-111.

 

Fraunhofer DDMC

The 6th Fraunhofer DDMC took place on March 12–13, 2025, in Berlin, and the next conference is planned for 2027. Abstract submissions are welcome until the end of May 2026.

Press releases of the Fraunhofer-Gesellschaft

3.3.2026

AI Chip Design From Heilbronn

AI plays a huge role in the semiconductor industry, both by facilitating more efficient development processes and as a target application in development work. This is why the Fraunhofer Heilbronn Research and Innovation Centers HNFIZ are adding the Chip AI research and innovation center for AI chip design to their service range. The center is funded via the Dieter Schwarz Foundation. The Chip AI research and innovation center relies on close cooperation with stakeholders of the Innovation Park Artificial Intelligence (IPAI).
more info

2.3.2026

Perfect Human-Machine Collaboration With NeurOSmart

How can we achieve intelligent teamwork between humans and robots in production? The Fraunhofer NeurOSmart technology platform combines sensor technology with AI-supported data processing and energy-efficient chips that mimic the way the human brain works.
more info

2.3.2026

GiantEye — New Dimensions in Computed Tomography

Looking inside an object without having to change it by opening it or taking it apart: This is the goal of nondestructive testing (NDT). However, only items that fit in the testing device can be scanned. In the GiantEye project, the Fraunhofer Institute for Integrated Circuits IIS is developing an innovative new high-energy computed tomography system at its Development Center X-Ray Technology in Fürth. This system enables nondestructive testing and digitalization of large and complex objects at the highest level of detail.
more info

2.3.2026

Fraunhofer is Developing an AI-Supported Learning Management System for the Bundeswehr

Artificial intelligence is set to provide optimum learning support for soldiers and increase teaching quality. Fraunhofer researchers have conducted a study to determine which AI functions would be useful in this context and how this technology could be integrated into the existing system.
more info

Fraunhofer Competence Field Additive Manufacturing Central Office

Nöthnitzer Straße 44

01187 Dresden / Germany

Phone +49 351 4772-2136

Fax +49 351 4772-32136