In the proposed development project, a software module for automatic component segmentation and graded adaptation of process parameters based on thermal simulation is to be developed.
Compared to existing approaches, such as the insertion of support structures to maintain dimensional accuracy, adaptation of the component design or the geometry-based identification and isolated treatment of down-skin areas, thermal simulation will be used to adapt the process parameters to the component design. For this purpose, the "heat dissipation capability" is applied. This value is a combination of the thermal conductivity of the material in combination with the geometric conditions of the component.
Michael Norda, email@example.com, +49 421 2246 231